• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    ELECTRICAL MACHINE A rotating electrical machine incorporating an electronic module (8) comprising a printed circuit (13) assembled with a plurality of surface-mounted electronic components (11) and a plurality of electronic components with terminals that pass through holes (12); the electric machine comprises a heatsink (9) to disperse the heat generated by the electronic module (8); surface-mounted electronic components (11) and electronic components with terminals that pass through holes (12) are mounted between the printed circuit (13) and the heatsink (9); the electronic module (8) also comprises a transfer element (19), also mounted between the printed circuit (13) and the heatsink (9), in thermal contact with at least one of the surface-mounted electronic components (11); the transfer element (19) is designed to disperse the heat generated by the surface-mounted electronic components (11) to the heatsink (9) with the aid of a thermally conductive and electrically insulating filling material (24) inserted between the transfer (19) and the heatsink (9).
    公开号:BR112015019542B1
    申请号:R112015019542-3
    申请日:2014-02-11
    公开日:2021-02-23
    发明作者:Pietro De Filippis
    申请人:Spal Automotive S.R.L.；
    IPC主号:
    专利说明:

    Technical field
    [001] The present invention refers to a rotating electrical machine and the respective method for its assembly, with particular reference to the integrated electronic control module. Rationale
    [002] In general, a rotating electrical machine comprises an enclosure that has a stator inside, rigidly connected to the enclosure, and a rotor, for example, with permanent magnets, rotatably connected to the enclosure.
    [003] An example of a state-of-the-art electric machine used as a reference for the present patent is described in application WO 20133008180 in the name of the same applicant.
    [004] An electronic module or electronic control module, connected to the stator, comprising a printed circuit and a plurality of active and passive electronic components that form a supply section and a plurality of electronic signal components that form a control section, mounted on the printed circuit.
    [005] The lid closes the enclosure to form a closed container from which the connection terminals are designed for the control and power supply connections of the electronic control system.
    [006] The electrical machines used as a reference for the present invention are of the hermetically sealed type, known in particular as of the sealed type, that is, sealed electrical machines.
    [007] One of the main difficulties of the sealed type of the electric machine is the dispersion of the heat generated by the electronic module during the operation of the electric machine.
    [008] A solution designed to overcome this difficulty is described in the aforementioned document, WO 20133008180, on behalf of the same applicant.
    [009] In this solution, the cover of the electric machine forms a transfer element, that is, a component to disperse the heat generated by the electronic module; the electronic signal and power components are mounted on the side of the printed circuit facing the cover.
    [0010] In addition, in this solution, a thermally conductive paste is inserted between the electronic components and the cover, in order to act as a heatsink, thus maximizing the heat exchange between the cover and the components.
    [0011] Currently, the market specifies electric machines, particularly those of sealed type, which provide high efficiency and high output power in relation to electric machines of known type and provide this higher performance in units of the same size.
    [0012] The development of these high performance electric machines has led to the adoption, in the electronic drive module, of electronic components of power with internal resistances less and less. The purpose of this development is to limit losses due to the Joule effect.
    [0013] However, despite the relatively low internal resistance of the electronic components of power, especially in high power applications (those with values of more than one KWatt) and in applications with low voltage power sources (operating with only a few volts) ), the currents circulating in the electronic components of power can cause relatively high losses due to the Joule effect. Another basic constraint of the project is that the heat generated by each electronic component of power must not decrease the efficiency of the electronic module of the machine.
    [0014] The printed circuit, in particular, seems to be the weak link in the electronic module, due to its maximum operating temperature being lower than that of the electronic components of power assembled and welded in the printed circuit itself. Description of the invention
    [0015] In this context, the main technical purpose of the present invention is to provide a rotating electrical machine that disperses the heat generated internally and, in particular, the heat produced by the electronic control module and to do this more effectively than the devices state-of-the-art in order to increase thermal reliability.
    [0016] This technical purpose and the specified objectives are substantially achieved by an electric machine having the technical characteristics described in independent claim 1. Brief description of the drawings
    [0017] Other features and advantages of the invention are more evident in the following detailed description, with reference to a preferred non-exclusive and non-limiting embodiment of a rotating electric machine, as illustrated in the accompanying drawings, in which: - figure 1 shows a perspective view of a rotating electrical machine according to the present invention; figure 2 is an exploded view of the machine in figure 1 with some parts removed to better illustrate others; figure 3 is a perspective view of the electronic module of the rotating electrical machine with some parts removed to better illustrate others; figure 4 is a cross section of the machine in figure 1; figure 5 is an enlarged view of the detail of a cross section of figure 4; figure 6 is a plan view from above of a platform (PAD) of the electronic module with some parts removed to better illustrate others; figure 7 is a plan view from above the platform of figure 6 of the electronic module that illustrates the layout of its electronic components; figure 8 is a plan view from above the platform of figure 7 of the electronic module showing the electronic components welded together; figure 9 is a plan view showing a portion of the electronic module of figure 3 with some parts removed to better illustrate others; figure 9a is an electrical circuit diagram of a branch of a power source bridge of the electronic module of figure 9 with some parts removed. Detailed description of the preferred embodiments of the invention
    [0018] With reference to the attached drawings, the number 1 indicates a rotating electric machine according to the present invention.
    [0019] Machine 1 in the preferred embodiment is a sealed type electric motor, that is, without any openings for access to the interior, to which hereinafter express reference will be made without, however, limiting the scope of the invention.
    [0020] The electrical machine 1 will be described in detail only for the parts necessary for the understanding of the present invention.
    [0021] The machine 1 comprises an enclosure 2 and a lid 3 to close the enclosure 2 to form, with the enclosure 2, a closed box or container 4.
    [0022] The electrical machine 1 comprises a stator 5 fixed in the housing 2 and comprises an electrical winding 6 and a rotor 7 inserted in the box 4 and connected to the box in a rotating mode.
    [0023] Machine 1 has its own rotation axis R, around which rotor 7 rotates.
    [0024] An example of stator 5 is described in patent EP 2215705, in the name of the same applicant, which is referred to here in its entirety for the purpose of a complete description.
    [0025] As illustrated in figures 2 and 3, the electrical machine 1 comprises an electronic module 8, inserted at least partially in the housing 2, to supply the electrical winding 6.
    [0026] The electric machine 1 further comprises a heatsink 9, in other words, the heatsink 9 to dissipate the heat generated inside the box 4, in particular, by the electronic module 8.
    [0027] In the illustrated embodiment, the transfer element is formed by the cover 3, for closing the box 2.
    [0028] The electronic module 8 comprises a plurality of electronic components 10.
    [0029] Electronic components 10 include surface-mounted electronic components 11, also known as SMD electronic components, and electronic components 12 mounted with terminals through holes, also known as PTH electronic components.
    [0030] The electronic module 8 of the electrical machine 1 comprises a printed circuit 13.
    [0031] Printed circuit 13 is substantially known as a PCB, that is, a printed circuit board.
    [0032] In particular, in the embodiment described in the example, the electronic components 10 are both of the SMD 11 and of the PTH 12 type and are mounted on the same side 14 of the printed circuit 13, also defined as the component side 14 of the printed circuit 13.
    [0033] The component side 14 of the printed circuit 13 forms the first side 14 of the electronic module 8.
    [0034] The electronic components 10 are mounted on the first side 14 of the electronic module 8, so that they are facing the cover 3.
    [0035] The electronic module 8 also comprises a plurality of conductive tracks 36, according to the electronic module 8 described and illustrated in the document W020133008180 by the same applicant, which implement the direct connections between all the surface-mounted electronic components 11 and the electronic components 12 with terminals going through holes.
    [0036] The conductive tracks 36 are positioned on a second side, or solder side 42, opposite the side of the components 14 of the printed circuit 13. In other words, the set consisting of the printed circuit 13, of the electronic components 10, both SMD 11 and PTH 12, and of the conductive tracks 36, form the electronic module 8, which comprises the control circuit of machine 1, which controls the power source.
    [0037] As illustrated, the conductive tracks 36 comprise a plurality of connection tabs 36a and connection terminals 36b. The connection terminals 36a and 36b are soldered on the printed circuit 13.
    [0038] SMD 11 electronic components comprise MOSFETs 15. MOSFETs 15 are SMD 11 electronic components of the power type.
    [0039] MOSFETs 15 are substantially of a known type and, for that reason, are not described in detail here. They are electronic components that have a housing 16 with a substantially parallelepiped shape and have a plastic part.
    [0040] For the sake of clarity, the following description refers specifically to MOSFET 15, without, however, limiting in any way the scope of the present invention.
    [0041] Each MOSFET 15 has a defined height hl which, in the solution shown in the example, extends in a direction parallel to the rotation axis R.
    [0042] In general, the height hl extends in a direction that is substantially perpendicular to the printed circuit 13.
    [0043] Each MOSFET 15 has its own electrical connection terminals 17 and 18.
    [0044] The connection terminals are defined as source 17 and drain 18 terminals.
    [0045] The terminals 17 and 18 of each MOSFET 15 are on opposite sides of the housing 16.
    [0046] The drain terminal 18 of each MOSFET comprises a flap that protrudes from the housing 16.
    [0047] According to the present invention, the electronic module 8 comprises a plurality of transfer elements 19, one for each MOSFET 15.
    [0048] In other words, as will be explained below, the electronic module 8 comprises a transfer element 19, preferably comprising an element with a high thermal conductivity, for each MOSFET 15.
    [0049] Advantageously, the transfer element 19 is also an electronic component of the SMD type or surface mounted device.
    [0050] Preferably, transfer element 19 is a component with a high level of electrical conductivity.
    [0051] In addition, each transfer element 19 is preferably connected directly to its respective MOSFET 15.
    [0052] Each of the transfer elements 19 has an associated electronic power component 11, of the surface mounted type, which comprises a respective MOSFET 15 and which is designed to increase the surface area for heat exchange and allow the transmission of the heat generated inside the component to the heatsink 9.
    [0053] In particular, each transfer element 19 is welded on the component side 14 of the printed circuit 13, so that it is also facing the cover 3.
    [0054] Each transfer element 19 is welded to one of the drain terminals 18 of MOSFET 15.
    [0055] This means that during the operation of the electric machine 1, the heat generated by each MOSFET 15 can easily flow to its corresponding transfer element 19 since the welding between terminal 18 and transfer element 19 provides a resistance of extremely low thermal contact.
    [0056] Preferably, the transfer element 19 is shaped in C so that it partially frames or surrounds the MOSFET 15 to which it is connected.
    [0057] In particular, the transfer element 19 comprises a first arm 20, a second arm 21 and a third arm 22, all connected in succession to each other.
    [0058] The second arm 21 is at a right angle to the first arm 20 and the third arm 22 is between the other two arms.
    [0059] MOSFET 15 is welded on the second arm 21 of its corresponding transfer element 19.
    [0060] The first arm 20 and the third arm 22 follow parallel to each other and extend along the sides of MOSFET 15.
    [0061] Advantageously, the transfer element 19 has recesses 23 for receiving terminal 18 of MOSFET 15, thus facilitating the connection by means of welding between the two components.
    [0062] Each transfer element 19 has a defined height h2, which in the solution shown in the example extends in a direction parallel to the rotation axis R.
    [0063] In general, the height h2 extends in a direction substantially perpendicular to the printed circuit 13.
    [0064] Advantageously, the machine 1 comprises a layer of thermally conductive filler material that fills a gap between the transfer element 19 and the heatsink 9.
    [0065] Advantageously, the filling material used, which fills the gap, is electrically insulating.
    [0066] In a preferred embodiment, provided as a non-limiting example, the thermally conductive material is a paste 24, to which reference will be made, but which will not be described in detail. The paste is inserted between the transfer element 19 and the heatsink 9. The MOSFETs 15 can be brought into contact with the cover 3 by means of the plastic part of the MOSFET 16 housing (without creating electrical short circuit problems). Preferably, there should also be a direct contact between the transfer element 19 and the flap 18 of MOSFET 15. In this situation, the insertion of a layer of filler material, such as a thermally conductive paste 24, of the type commonly known as material thermally conductive filling of the gap, the thickness of which is within the range of heights hl and h2, between the transfer element 19 and the cover 3, creates a preferential path for the heat dissipated by the MOSFET 15.
    [0067] The transfer element 19 acts as a thermal joint, that is, a means that favors the transfer of the heat generated by MOSFET 15 towards the cover 3.
    [0068] Each transfer element 19 has an upper face 19a, facing the cover 3, which forms the heat exchange surface, through which the transfer element 19 transfers most of the heat generated by MOSFET 15 to the cover 3 which, as already mentioned, acts in turn as a sink 9.
    [0069] The surface area 19a is made as large as possible, within the limitations of size design, in order to minimize resistance to the passage of heat.
    [0070] It should be noted that a part of the heat generated by each MOSFET 15 is transferred to the cover 3, through the housing 16 facing it, which is preferably in mechanical contact with the cover 3.
    [0071] However, most of the heat generated by each MOSFET 15 is transferred to the cover by means of the corresponding transfer element 19.
    [0072] In other words, the upper face 19a of each transfer element 19, considerably increases the heat transfer surface of MOSFET 15.
    [0073] Advantageously, most of the heat generated by the MOSFETs 15 is transferred to the heatsink 3 by means of the transfer element 19.
    [0074] This provision prevents the heat generated by MOSFETs 15 from being transferred to the printed circuit 13 on which MOSFETs 15 are mounted and welded.
    [0075] Preferably, the transfer element 19 is made of a material, such as copper, which has high thermal and electrical conductivity.
    [0076] In order to optimize the thermal contact between the cover 3, which acts as a transfer element, the MOSFETs 15 and the transfer element 19 mounted on the component side 14 of the printed circuit 13, the cover 3 has at least one contact 25 defined by a substantially flat portion of the inner surface of the lid 3.
    [0077] The insertion of a thermally conductive gap filler, such as paste 24, maximizes the heat transfer between the electronic components 10 and, in particular, between the MOSFETs 15 and the corresponding transfer element 19, mounted on the side of the components 14 of the printed circuit 13 and the cover 3.
    [0078] As shown in the detail in figure 5, the thermally conductive paste 24 fills any empty spaces remaining after assembly between the electronic components 10, the transfer elements 19 of high thermal and electrical conductivity and the flat contact 25.
    [0079] Advantageously, the height h2 of each transfer element 19 is less than the height hl of housing 16 of the corresponding MOSFET 15, so that MOSFET 15 act as spacer elements that separate cover 3 from the elements of transfer 19, thus avoiding any short circuits that could occur after direct contact between the transfer elements 19, the elements with high electrical and thermal conductivity, and the cover 3 of the machine 1.
    [0080] In the case where the height h2 of the transfer element 19 is greater than the height hl of the housing 16 of the MOSFET 15, an alternative arrangement to prevent short circuits resulting from direct mechanical contact between the transfer element 19 and the cover 3 would be to insert a thermally conductive and electrically insulating material, such as the SH-Pad, between the cover 3 and the upper face 19a of the transfer element 19.
    [0081] In another embodiment, not shown here, the transfer element 19 is thermally conductive, but electrically non-conductive, and the height h2 of the transfer element is greater than or equal to the height hl of the connected MOSFET 15 transfer element 19.
    [0082] Advantageously, in this arrangement, the transfer element 19 is in contact with the cover 3 and, thus, directly transfers the heat generated by the corresponding MOSFET 15 to the cover 3.
    [0083] The outer surface of the cover 3 has a plurality of fins 26 to dissipate the heat generated by the electronic module 8, thus maximizing the dissipation surface of the heatsink 9.
    [0084] In order to push the electronic module 8 towards the cover 3 and maximize the heat exchange between the transfer elements 19 and the cover 3, the electrical machine 1 comprises a plurality of elastic elements that push the electronic module 8 to away from stator 5, towards cover 3.
    [0085] A preferred example of mounting the electronic module 8 inside the machine 1 is the example described and illustrated in document W020133008180 by the same applicant.
    [0086] The electric machine 1 comprises a support 43 preferably made in the form of a disk from plastic material, which houses the electronic module 8.
    [0087] The elastic elements, which push, act directly on the support 43 in order to push the electronic module 8 towards the cover 3 until the envelopes 16 of the MOSFETs 15 come into mechanical contact with the cover.
    [0088] In this way, the heat exchange between the electronics module and the heatsink 9 is further improved.
    [0089] The method of assembling the electronic module 8 comprises a stage of preparation, with known methods, of the printed circuit 13.
    [0090] This preparation step involves, first, placing a thin layer of solder paste 35 on the component side 14 of the printed circuit 13 and then placing the SMD electronic components on the surface thereof.
    [0091] Preferably, the transfer element 19 is welded before being positioned on the printed circuit 13, in order to facilitate the welding of this component in the electronic module, as explained in more detail below.
    [0092] Printed circuit 13 comprises a plurality of platforms 27 for housing MOSFETs 15 and their corresponding transfer elements 19.
    [0093] Figure 6 shows that the platform 27 is preferably formed by at least two portions, a first portion 27a and a second portion 27b, each designed to receive transfer element 19 and MOSFET 15, respectively .
    [0094] In the illustrated preferred embodiment, the first portion 27a and the second portion 27b are contiguous.
    [0095] The platform is bounded by a perimeter demarcation line 28, which makes it possible to verify that the transfer element 19 is in the correct position once it has been soldered on the printed circuit 13.
    [0096] In a preferred embodiment, the TJ platform is substantially E-shaped, with two side sections 29 and 30 joined together by a central body 31, and an intermediate section 32, positioned between the two side sections 29 and 30 , which extends from the central body 31.
    [0097] The format of platform 27 corresponds to the format of the set formed by transfer element 19 and its corresponding MOSFET 15.
    [0098] In fact, the transfer element 19 is shaped in C, in which the first and third arms 20 and 22 are designed to fit over the side sections 29 and 30 of the platform 27 and the second arm 21 is designed to fit on the central body 31 of the platform 27; MOSFET 15 is designed to fit over the intermediate section 32 when it is welded on the second arm 21 of the transfer element 19.
    As a result, the side sections 29 and 30 and the central body 31 define the first portion 27a and the intermediate section 32 defines the second portion 27b.
    [00100] From the description so far, it can be deduced that the format of platform 27 is strictly dependent on the format of transfer element 19 and the location of the connection between MOSFET 15 and its corresponding transfer element 19.
    [00101] The TJ platform has a pair of cuts 33, which extend mainly in the length direction, preferably parallel to each other along the side of the intermediate section 32.
    [00102] In particular, in the preferred embodiment illustrated here, each cut 33 is located between each of the side sections 29 and 30 of the platform 27 and the intermediate section 32.
    [00103] Advantageously, the cuts 33 act as guides for the MOSFET 15, which during welding is moved in a longitudinal direction parallel to the cuts 33, and then connects to its corresponding transfer element 19.
    [00104] The platform 27 has a plurality of recesses 34 designed to prevent any rotation in relation to the transfer element 19 during the welding of the printed circuit 13.
    [00105] In particular, the recesses 34 are located along the sides of the first portion 27a designed to receive the transfer element 19.
    [00106] Solder paste 35 is placed inside the perimeter of platform 27.
    [00107] Solder paste 35 is applied to areas in polygonal format.
    [00108] The areas of the solder paste 35 are distributed in such a way that they uniformly cover the first portion 27a and the second portion 27b of the platform 27.
    [00109] The method has a step for positioning the transfer element 19 on the first portion 27a and a step for positioning the MOSFET 15 to be connected to the transfer element 19 of the second portion 27b. As shown in figure 7, MOSFET 15 is positioned at a specified distance "s" from transfer element 19.
    [00110] MOSFET 15 is positioned, at least in part, on the second portion 27b of platform 27.
    [00111] The welding step for SMD electronic components takes place inside a temperature controlled oven using the assembly method known as "reflow soldering".
    [00112] The welding takes place keeping the printed circuit 13 in a substantially horizontal position with the SMD components resting on the surface.
    [00113] More specifically, according to the present invention, the shape of the platform 27 and the position of the solder paste 35 on the insert makes it possible to hold the transfer elements 19 in position while advancing the MOSFETs 15 towards the elements transfer.
    [00114] The method involves a step to provide MOSFET 15 towards transfer element 19 for a distance that is at least the same as the specified distance "s".
    [00115] The course or displacement of MOSFETs 15 towards transfer element 19 allows terminal 18 to make contact with transfer element 19 and be welded to it.
    [00116] It should be noted that the displacement of MOSFET 15 towards the transfer element 19 is necessary in order to allow welding, since, during the positioning of MOSFET 15 on the printed circuit 13, the MOSFET is still physically separated from the transfer element 19 by the specified gap "s". The "s" gap is closed by moving MOSFET 15 towards the transfer element 19.
    [00117] The cuts 33 guarantee that when the MOSFET 15 is moved towards the transfer element 19, it will be moved in a straight line, parallel to the cuts, without turning.
    [00118] Figure 8 shows that the welding step includes a step in which transfer element 19 approaches its corresponding MOSFET 15 and close contact occurs between terminal 18 of MOSFET 15 and arm 31 of transfer element 19 .
    [00119] In other words, the approach step occurs during the welding step.
    [00120] During the welding step, transfer elements 19 and MOSFETs 15 are welded in their corresponding first portions 27a and 27b.
    [00121] The recesses 34 prevent the rotation of each transfer element 19 in relation to the portion 27a of the TI platform in the printed circuit 13, on which they are placed.
    [00122] It is clear that the present invention overcomes the various disadvantages described above with reference to the state of the art.
    [00123] In fact, transfer elements 19 remove most of the heat generated by their corresponding MOFSETs 15 and transfer it to cover 3, from where it is then dissipated. This prevents heat from flowing through the printed circuit 13 and causing overheating.
    [00124] The transfer elements 19 effectively remove the heat from their respective MOSFETs 15 thanks to the high thermal conductivity of the transfer elements 19 and the efficient exchange with the cover 3, in particular, thanks to the extension of its upper face 19a.
    [00125] The mentioned MOSFETS 15 are connected to each other to form a bridge connection from the power source to machine 1; this bridge is of a substantially known type and will therefore not be described in detail here.
    [00126] Advantageously, the high electrical conductivity of the transfer elements 19 means that they can also be used to make an electrical connection between the MOSFETs 15 and, therefore, form the branches of the power bridge of phases 41 of the machine 1 .
    [00127] Motor 1 is preferably a three-phase motor, which means that the motor power jumper consists of three branches, one for each corresponding phase 41 of motor 1.
    [00128] For the sake of simplicity, figures 9 and 9a show only a single branch 42 of the bridge. The branch is substantially of a known type and only the parts necessary for the understanding of the present invention will be described here. The figures show that the SMD 11 electronic components comprise a first MOSFET 37 and a second MOSFET 38 electrically connected to each other to form this branch of the power source.
    [00129] Advantageously, for any motor without multi-phase bushings, the power source bridge can have several branches 42, according to the phases of the motor.
    [00130] A transfer element 19 is connected to the first MOSFET 37 or the second MOSFET 38 and electrically connects the drain terminal 18 of the first MOSFET 37 to the source terminal 17 of the second MOSFET 38.
    [00131] Thus, the first MOSFET 37, the second MOSFET 38 and the transfer element 19 define a branch of the power source of a phase 41 of the motor 1.
    [00132] In particular, a first transfer element 39, welded to drain 18 of the first MOSFET 37, electrically connects the drain terminal 18 of the first MOSFET 37 to the bridge power source.
    [00133] A second transfer element 40, welded to drain 18 of the second MOSFET 38, electrically connects drain 18 of the second MOSFET 38 to the source terminal 17 of the first MOSFET 37.
    [00134] Advantageously, the second transfer element 40 electrically connects the drain terminal 18 of the second MOSFET 38 and the source terminal 17 of the first MOSFET 37 to the corresponding phase 41 of the stator winding.
    [00135] It should be noted that the electrical connections between the first MOSFET 37, the second MOSFET 38, the transfer element 19 and the motor phase are made by connecting these components to the conductive tracks 36 of the electronic module 8.
    [00136] In addition, since motor 1 is a three-phase motor, each phase 41 is connected to a pair of MOSFET 15 formed by the first MOSFET 37 and the second MOSFET 38.
    [00137] Figure 9 shows that the first and second MOSFET 37 and 38, which define a branch of the energy source, are positioned in directions that are mainly at right angles to each other.
    [00138] The first and second transfer elements 39 and 40, involve at least partially their respective first and second MOSFETs 37 and 38 and, therefore, are also positioned in directions that are mainly at right angles to each other.
    [00139] Advantageously, the position of the MOSFET pairs 15 at right angles to each other for each phase of the motor is a minimum global configuration of the MOSFET pairs 15 and their respective transfer elements 19 in the printed circuit 13 of the electronic module 8 and, at the same time, it is also the configuration that limits the distances of the electrical paths between the electrical components electrically connected to each other.
    权利要求:
    Claims (16)
    [0001]
    1. Rotating electrical machine, which has its own axis of rotation (R), comprising: - an electronic module (8), comprising a printed circuit (13) and a plurality of SMD electronic components (11) and a plurality of components PTH electronics (12) and a heatsink (9) to dissipate the heat generated by the electronic module (8); - SMD electronic components (11) and PTH electronic components (12) facing the heatsink (9); the electronic module (8) comprising at least one transfer element (19) connected to the printed circuit (13) in the position of at least one SMD electronic component (11) in order to transfer the heat generated by the SMD electronic component (11) to the heatsink (9), the machine being characterized by the SMD electronic components (11) comprise a plurality of MOSFETs (15), each of which has its own terminals (17, 18) and, the transfer element ( 19) is soldered on the first side (14) of the printed circuit (13) and at least one of the terminals (17,18) of the respective MOSFET (15).
    [0002]
    2. Machine according to claim 1, characterized in that the transfer element (19) is connected to its corresponding SMD electronic component (11).
    [0003]
    3. Machine according to claim 1 or 2, characterized in that the SMD electronic components (11) and the PTH electronic components (12) and the transfer element (19) are located on the first side (14) of the printed circuit ( 13).
    [0004]
    Machine according to any one of claims 1 to 3, characterized in that it comprises a layer of thermally conductive material inserted between the transfer element (19) and the heatsink (9) and the transfer element (19) transfers the heat generated by the electronic component SMD (11) to the heatsink (9) by means of a thermally conductive material.
    [0005]
    Machine according to any one of claims 1 to 4, characterized in that the printed circuit (13) comprises a platform (27) for positioning the transfer element (19) and the SMD electronic component (11); each platform (27) featuring a first portion (27a) for the transfer element (19) and a second portion (27b) for the SMD electronic component (11).
    [0006]
    Machine according to claim 5, characterized in that the first and second portions (27a, 27b) are contiguous.
    [0007]
    Machine according to claim 5 or 6, characterized in that the first and second portions (27a, 27b) are separated by at least one cut (33).
    [0008]
    Machine according to any one of claims 5 to 7, characterized in that the first portion (27a) of the platform (27) has a perimeter demarcation line (28) which has at least one recess (34).
    [0009]
    Machine according to any one of claims 1 to 8, characterized in that the transfer element (19) comprises at least a first arm (20) and a second arm (21) connected to each other in succession and the SMD electronic component (11) is connected to the first arm (20) or the second arm (21).
    [0010]
    Machine according to any one of claims 1 to 9, characterized in that the SMD electronic components (11) comprise at least one first MOSFET (37) and at least one second MOSFET (38) and the transfer element being (40) electrically connects the source terminal (17) of the first MOFSET (37) with the drain terminal (18) of the second MOSFET (38); the first MOFSET (37), the second MOFSET (38) and the transfer element (40) define a one-phase power source branch of the electrical machine (1) to form an electrical machine power source bridge (1 ).
    [0011]
    11. Machine according to claim 8, characterized in that the first and second MOSFET (37, 38), which define the branch of power supply of an electric machine phase (1), are positioned along directions that are mainly at right angles to each other; the first and second transfer elements (39, 40) associated with the respective first and second MOSFETs (37, 38) are positioned along directions that are mainly at right angles to each other.
    [0012]
    Machine according to any one of claims 1 to 11, characterized in that the height (h2) of the transfer element (19), measured in a direction substantially perpendicular to the printed circuit (13), is less than the height (hl) of the SMD electronic component (11) connected to the transfer element (19), measured in a direction perpendicular to the printed circuit (13), and the SMD electronic component (11) connected to the transfer element (19) acts as a spacer element between the heatsink (9) and the transfer element (19).
    [0013]
    13. Machine according to any one of claims 1 to 11, characterized in that the height (h2) of the transfer element (19), measured in a direction perpendicular to the printed circuit (13), is greater than, or equal to , the height (hl) of the SMD electronic component (11) connected to the transfer element (19), measured in a direction perpendicular to the printed circuit (13).
    [0014]
    14. Machine according to any one of claims 1 to 13, characterized in that it comprises a support (43) which houses the electronic module (8) and the elastic elements, which push, operate between the stator and the support and act directly on the support (43) in order to push the electronic module (8) towards the heatsink (9) and away from the stator (5); the electronic module (8) comprises a plurality of conductive tracks (36) located on the second side (42) opposite the first side (14) of the printed circuit (13).
    [0015]
    15. Method for assembling a rotating electrical machine, as defined in any one of claims 1 to 14, characterized in that it comprises an assembly step for the electronic module (8) comprising a step for the application of a solder paste (35 ) on the printed circuit (13) on a platform (27) for the transfer element (19) and for each MOSFET (15); the platform (27) has a first portion (27a) for the transfer element (19) and a second portion (27b) for the respective MOSFET (15), and the method also comprises a step for positioning the transfer element transfer (19) on the first portion (27a) and a step for positioning the MOSFET (15) to be connected to the transfer element (19) on a second portion (27b); the MOSFET (15) being positioned at a predefined distance (s) from the transfer element (19).
    [0016]
    16. Method according to claim 15, characterized in that it comprises a step to advance the MOSFET (15) towards the transfer element (19), by a distance that is at least equal to the predefined distance (s); the advance step comprises a step to weld the transfer element (19) to its respective MOSFET (15) and the transfer element (19) on the platform (27) and to weld the MOSFET (15) on the platform (27).
    类似技术:
    公开号 | 公开日 | 专利标题
    BR112015019542B1|2021-02-23|electric machine and its assembly method
    BR112014000619B1|2020-11-10|rotating electrical machine and related assembly method
    JP2017069581A|2017-04-06|Semiconductor device, assembly method of the same, component for the same, and unit module
    JP6890958B2|2021-06-18|Electronic device for supplying electric power to electric machines of automobiles
    US8817475B2|2014-08-26|System with shared heatsink
    US9105598B2|2015-08-11|Package/heatsink system for electronic device
    JP5936310B2|2016-06-22|Power semiconductor module and its mounting structure
    BRPI1007570B1|2021-03-16|electrical machine stator and method for winding a stator
    JP2004524701A|2004-08-12|Power module
    US8837153B2|2014-09-16|Power electronic device having high heat dissipation and stability
    TW201816982A|2018-05-01|Electronic device
    US4738024A|1988-04-19|Method of making a heat dissipating assembly
    JP2017139450A|2017-08-10|Electronic power module, electronic architecture including the same, voltage converter, and electric machine including the same
    JP2020526930A|2020-08-31|Power semiconductor module
    BR112019025288A2|2020-06-23|ELECTRIC DRIVING DEVICE AND ELECTRIC POWER STEERING DEVICE
    US20200076278A1|2020-03-05|Electric machine
    JP2020170796A|2020-10-15|Semiconductor module and manufacturing method thereof
    JP6780792B2|2020-11-04|Circuit components and electrical junction boxes
    US20210344259A1|2021-11-04|Electric machine
    JP2021158208A|2021-10-07|Electronic module
    US10862375B2|2020-12-08|Rotary electric machine
    WO2019107106A1|2019-06-06|Circuit board and circuit board manufacturing method
    US20130003313A1|2013-01-03|System with stabilized heatsink
    TW201933978A|2019-08-16|Circuit assembly and mounting unit
    同族专利:
    公开号 | 公开日
    ITBO20130063A1|2014-08-15|
    EP2957020B1|2019-12-04|
    US20160006322A1|2016-01-07|
    JP6449787B2|2019-01-09|
    RU2015133232A|2017-03-17|
    KR20150118134A|2015-10-21|
    BR112015019542A2|2017-07-18|
    CN105052019B|2018-08-10|
    US9912211B2|2018-03-06|
    JP2016507214A|2016-03-07|
    EP2957020A1|2015-12-23|
    RU2641659C2|2018-01-19|
    CN105052019A|2015-11-11|
    WO2014125412A1|2014-08-21|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    JPH0526936Y2|1985-04-03|1993-07-08|
    US6081056A|1996-03-07|2000-06-27|Seiko Epson Corporation|Motor and method for producing the same|
    JP3622362B2|1996-09-19|2005-02-23|株式会社デンソー|Electric power steering device|
    GB9715338D0|1997-07-21|1997-09-24|Amp Holland|A unit for controlling electrical motors|
    US6949849B1|1998-06-30|2005-09-27|General Electric Company|Motor endshield assembly for an electronically commutated motor|
    JP3401640B2|2000-02-29|2003-04-28|ミネベア株式会社|Blower and manufacturing method thereof|
    JP3638269B2|2002-03-14|2005-04-13|三菱電機株式会社|Electric power steering device|
    EP1363026A3|2002-04-26|2004-09-01|Denso Corporation|Invertor integrated motor for an automotive vehicle|
    DE10252315A1|2002-11-11|2004-06-03|Minebea Co., Ltd.|Connector of electronic components for control of electric motor with stamped grid, containing conductive tracks for connecting supply lines and phase windings of motor, while conductive tracks|
    JP3856767B2|2003-05-07|2006-12-13|多摩川精機株式会社|Motor with brake|
    JP4374909B2|2003-05-27|2009-12-02|パナソニック電工株式会社|Brushless motor|
    JP4404726B2|2004-08-31|2010-01-27|三菱電機株式会社|Automotive power converter|
    RU50728U1|2005-03-21|2006-01-20|Закрытое акционерное общество "Электроприбор"|RECTIFIER BRIDGE BLOCK|
    CN200990577Y|2006-08-28|2007-12-12|中山大洋电机股份有限公司|Controller structure for DC brushless electric machine|
    US20080073986A1|2006-09-26|2008-03-27|Lg Electronics Inc.|Permanent magnet rotor type motor and method for manufacturing the same|
    ITBO20070791A1|2007-11-30|2009-06-01|Spal Automotive Srl|ROTARY ELECTRIC MACHINE AND ASSEMBLY METHOD OF THE SAME.|
    JP4580999B2|2008-03-19|2010-11-17|日立オートモティブシステムズ株式会社|Motor control unit|
    JP5585013B2|2009-07-14|2014-09-10|日亜化学工業株式会社|Light emitting device|
    JP2012004162A|2010-06-14|2012-01-05|Yokogawa Electric Corp|Heat dissipation apparatus for surface mounting component|
    US8506264B2|2010-08-16|2013-08-13|Sunonwealth Electric Machine Industry Co., Ltd.|Motor and cooling fan with a circuit board having a heat-conducting insulator|
    ITBO20110413A1|2011-07-11|2013-01-12|Spal Automotive Srl|ROTARY ELECTRIC MACHINE AND RELATIVE ASSEMBLY METHOD.|
    ITBO20120229A1|2012-04-26|2013-10-27|Spal Automotive Srl|ELECTRIC MACHINE.|
    ITBO20130063A1|2013-02-14|2014-08-15|Spal Automotive Srl|ELECTRIC MACHINE.|
    US9431881B2|2013-03-15|2016-08-30|Regal Beloit America, Inc.|Electric machine housing|
    ITBO20130271A1|2013-05-29|2014-11-30|Spal Automotive Srl|ELECTRIC MACHINE.|
    DE102013212446A1|2013-06-27|2015-01-15|Zf Friedrichshafen Ag|Electric circuit and method for producing an electrical circuit for driving a load|
    ES2555121T3|2013-07-08|2015-12-29|Fagor, S. Coop.|Electric drive device|
    DE102014200763A1|2014-01-17|2015-07-23|Ebm-Papst Mulfingen Gmbh & Co. Kg|Multifunction opening|
    DE102014206536A1|2014-04-04|2015-10-08|Robert Bosch Gmbh|Electric machine with shielding plate|
    JP6146380B2|2014-07-31|2017-06-14|株式会社デンソー|Electronic equipment|
    US9595854B2|2014-08-12|2017-03-14|Regal Beloit America, Inc.|Electric machine, moisture guide and associated method|
    JP6398708B2|2014-12-26|2018-10-03|株式会社デンソー|Electronic device and driving device using the same|
    JP6540986B2|2015-01-26|2019-07-10|株式会社デンソー|Electric rotating machine|
    US10128723B2|2015-07-07|2018-11-13|Milwaukee Electric Tool Corporation|Printed circuit board spacer|JP5839959B2|2011-11-22|2016-01-06|アスモ株式会社|Control motor|
    JP6045380B2|2013-02-08|2016-12-14|リョービ株式会社|Vertical power tool|
    ITBO20130063A1|2013-02-14|2014-08-15|Spal Automotive Srl|ELECTRIC MACHINE.|
    JP6160576B2|2014-07-31|2017-07-12|株式会社デンソー|DRIVE DEVICE AND ELECTRIC POWER STEERING DEVICE USING THE SAME|
    US10177633B2|2014-12-23|2019-01-08|Abb Schweiz Ag|Multiphase fractional slot concentrated winding machine with end mounted detachable or integrated multiphase series converter circuit|
    DE112017005289T5|2017-02-02|2019-07-25|Borgwarner Inc.|Electric machine with pressed-in electronic module|
    IT201700024276A1|2017-03-03|2018-09-03|Spal Automotive Srl|ELECTRIC MACHINE|
    CN108964363A|2017-05-17|2018-12-07|德昌电机有限公司|A kind of engine cooling mould group of motor, the control circuit board and application motor|
    EP3506466B1|2017-12-28|2021-03-10|SPAL Automotive S.r.l.|Rotary electric machine|
    RU2710902C1|2018-09-12|2020-01-14|Владимир Анатольевич Кузнецов|Frameless synchronous rotary electric machine|
    IT201800009611A1|2018-10-19|2020-04-19|Spal Automotive Srl|ELECTRIC MACHINE.|
    US20210344259A1|2020-04-29|2021-11-04|Spal Automotive S.R.L.|Electric machine|
    法律状态:
    2018-11-13| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2020-02-04| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|
    2020-12-08| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2021-02-23| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 11/02/2014, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    IT000063A|ITBO20130063A1|2013-02-14|2013-02-14|ELECTRIC MACHINE.|
    ITBO2013A000063|2013-02-14|
    PCT/IB2014/058904|WO2014125412A1|2013-02-14|2014-02-11|Electrical machine|
    [返回顶部]